Silicon Substrate Interconnection Circuit Design
نویسندگان
چکیده
منابع مشابه
Dynamic Reconfiguration of Silicon Photonic Circuit Switched Interconnection Networks
Silicon photonic interconnection networks can provide significant advantages in bandwidth densities and data communication energy efficiencies over electronic-interconnected systems. However, due to the circuit switched nature of photonics, the latencies associated with circuit setup and reconfiguration must be managed to avoid added delays in application execution time. This work characterizes...
متن کاملPhotonic Interconnection Circuit
We demonstrate a fully-integrated photonic Wavelength Division Multiplexing (WDM) transceiver circuit with heterogeneous integration on silicon, and on-chip interconnection with total transmission capacity up to 8×8×40 Gbps. OCIS codes: (130.0250) Optoelectronics; (130.3120) Integrated optics devices; (060.4510) Optical communications.
متن کاملCircuit Design and Technological Limitations of Silicon RFICs
Wireless products and communications systems have thrived on the increased utility enabled by semiconductor technologies, the demand for which is necessitating ever higher communication channel frequencies to obtain wider bandwidth and to alleviate interference. This places still greater demands on the technologies used to implement the wireless systems; however, for a given application, the ma...
متن کاملModelling Circuit - Switched Multi - Stage Interconnection Networks
Peter G Harrison and N aresh M Patel Department of Computing Imperial College London A major component of a parallel machine is its interconnection network (IN), which provides concurrent communication between the processing elements. It is common to use a multi-stage interconnection network (MIN) which is constructed using crossbar switches and introduces contention not only for destination ad...
متن کاملPackaging Design with Thermal Analysis of LED on Silicon Substrate
In this paper, we demonstrate a package method for a package component of LED (Light Emitting Diode) using state of the art MEMS technologies and careful materials selection such as using a silicon substrate to dissipate heat and match thermal expansion coefficient (CTE). The objective is to develop an LED package that can overcome LED life, high operating voltage, package degradation and the a...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Optoelectronics
سال: 2016
ISSN: 2164-5450,2164-5469
DOI: 10.12677/oe.2016.62008